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Dowa Electronics Materials Co., Ltd.
1
Oracle
DuPont Teijin Films
Quantum
Hewlett-Packard
Teijin DuPont Films
IBM
Toda Kogyo
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Imation
Toray
1
International Data Corp.
1
1
Limited Member
Associate Members
Argonne National Laboratory
Tsinghua University
Arizona State University
University of Alabama
Brown University
University of Alaska Fairbanks
Carnegie Mellon University
University of Alberta
Colorado State University
University of Arizona
Data Storage Institute
University of California, Berkeley
Georgia Institute of Technology
University of California, San Diego
Institute of Materials Research & Engineering
University of Central Lancashire
Iowa State University
University of Colorado Boulder
Johns Hopkins University
University of Exeter
Lawrence Berkeley National Laboratory
University of Hawaii
Lawrence Livermore National Laboratory
University of Houston
Los Alamos National Laboratory
University of Illinois
Massachusetts Institute of Technology
University of Manchester
Massey University
University of Massachusetts Amherst
National Institute for Materials Science
University of Minnesota
National Institute of Standards and Technology
University of Nebraska
National Tsing Hua University
University of Oklahoma
National University of Singapore
University of the Pacific
Northeastern University
University of Pittsburgh
Northwestern University
University of Washington
Ohio State University
University of Wisconsin - Milwaukee
Purdue University
Vanderbilt University
Stanford University
Vienna University of Technology
St. Poelten University of Applied Sciences
Virginia Commonwealth University
Texas A & M University
Washington University
Tohoku University
Yonsei University
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